Bringing Advanced Packaging to the next level with SCHNEEBERGER Precision Positioning Systems
SCHNEEBERGER's high-precision positioning systems are designed to meet the demanding requirements of advanced semiconductor packaging, including die-to-wafer hybrid bonding. Designed for operation in cleanroom environments, these systems deliver sub-micron accuracy, long-term stability and seamless automation integration. Whether supporting AI accelerators, high performance computing or 5G chipsets, SCHNEEBERGER motion platforms deliver the reliability and precision required for today's most demanding packaging technologies.
SCHNEEBERGER positioning systems enable ultra-precise motion and alignment processes tailored for cutting-edge semiconductor packaging applications. With exceptional stability and repeatability, they meet the highest standards for cleanroom environments and offer the flexibility required for next-generation chip integration. Whether aligning chiplets or placing die on wafers, SCHNEEBERGER delivers the accuracy advanced packaging demands.
Versatile Processing Capabilities
Customised solutions - built to spec and application
Ultra-Precision Integration
Precision is essential for heterogeneous integration in semiconductor technology. SCHNEEBERGER systems ensure sub-micron motion accuracy, making them ideal for high-volume manufacturing and cleanroom-compliant performance.
Flexible Production Solutions
Designed for scalability, our systems can be configured based on our customers requirements. This modularity allows seamless integration into various production flows while maintaining consistent positioning performance and process quality across all units.
Advanced Process Control
Fully automated motion systems ensure precise, repeatable operations – critical for process consistency in die placement and hybrid bonding workflows. Automation increases throughput, reduces operator error, and enhances yield, making SCHNEEBERGER a reliable partner in high-end semiconductor production.
